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Please read our latest Milwaukee Electronics Newsletter, which includes:

  • A Message from Mike Stoehr, CEO
  • Tecate, MX Facility Technology Investment & Expansion
  • Test Engineering Optimizes Functional Testing

Milwaukee Electronics Newsletter Q3 2019

As we pass though the last month of Summer, Milwaukee Electronics shares a valuable market review.  While the supply chains of electronic manufacturers around the world are challenged by the impacts of component shortages, allocation, capacity & lead time issues; there are signs of stability, recovery and growth.

MLCCs

Multilayer Ceramic Capacitor (MLCC) inventory is beginning to build up, possibly due to over-ordering in the marketplace by end users and distributors.  Several key distributors are now holding stock on lines that have been on allocation over the past 18 months.  The problem of allocation has not resolved itself fully, but it is becoming a less critical issue as the market improves and smaller case sizes become more readily available.  Larger case sizes are still problematic, in part due to TDK and Murata obsoleting a large proportion of their MLCC catalog (over 241,000 and 9,000 product lines respectively).

 

Sales and Acquisitions

Infineon is set to acquire semiconductor company Cypress.  This will allow them to compete in the Electric Vehicle (EV) market and become a significant chip-maker in the global market. The deal is set to be completed by early 2020.

Marvell have sold their wireless and Bluetooth business to NXP for $1.76 billion which is set to complete by Q1 2020.

GlobalFoundries have agreed on the sale of their New York based 300mm fab to ON Semiconductor for $430 million. ON Semi will gain full operational control of the fab by the end of 2022, with GlobalFoundries manufacturing 300mm wafers on site until handover is completed.

 

Capacity and lead-time issues

There is a global shortage of Silicon Carbide (SiC) due to a limited number of vendors being able to produce the wafers. ST Microelectronics is strategically investing to ensure they have a supply chain that will be able to support the growing use of SiC in high power/high efficiency needed in consumer markets such as EV’s and the Internet of Things (IoT).

TDK and KOA have closed their order books whilst they battle to ensure continuity of supply to their customers with MLCC’s and commodity resistors. This is the same response as Murata, Rohm (resistor networks) and Vishay (passives).

  • Samsung continues to cite allocation on many of their MLCC lines however there is still evidence of stock availability in the marketplace.
  • Diodes Inc. are seeing allocation on many of their Zener diodes, bipolar and digital transistor and some general-purpose transistors.
  • Infineon MOSFETs are on allocation with short supply globally.
  • Yageo lines are more readily available with lead-times around 20 weeks.
  • TE connectors are experiencing lengthy lead-times and relays are on allocation.  This is most notable with circular connectors, TE’s Deutsch line and automotive connectors.
  • ST Microelectronics has partnered with Cree to supply Wolfspeed SiC wafers during a period of growth.
  • Analog Devices are experiencing production delays with lead-times on certain lines extending beyond 24 weeks and in some cases over 32 weeks.
  • MLCC pricing is stable despite the ongoing market conditions but is not decreasing significantly.
  • Analog Devices pricing (including Linear Technology lines) is expected to increase, and lead-times are still beyond those that are usually observed.
  • Infineon MOSFETS are on allocation (fueled further by the SiC shortage) and pricing is unstable, with increases observed during the last 6 months.
  • Murata filter pricing is set to increase.

 

 

Please read our latest Milwaukee Electronics Newsletter, which includes:

  • Message from Rick McClain, President & COO
  • FactoryLogix Implementation
  • Test Engineering Group wins
  • New NPI Manager named
  • Increased medical business in Oregon

Milwaukee Electronics Newsletter Q2 2019

Please read our latest Milwaukee Electronics Newsletter, which includes:

  • Message from Mike Stoehr
  • Supporting a Hot B2C Start Up
  • Test Fixtures for High Volume Production
  • Growth in the New Year
  • User Groups at San Diego PCB, LLC

 

Milwaukee Electronics Newsletter Q1 2019

Please read our latest newsletter for Milwaukee Electronics, which includes:

  • Message from Mike
  • Portland Facility Completes Transition to ISO 13485:2016
  • Agricultural Product Ramps Up
  • Cybersecurity & Compliance Enhancements
  • Screaming Circuits Engineering in Action
  • BioMEDevice Exhibit Big Success

Milwaukee Electronics Newsletter Q4 2018

 

Milwaukee Electronics’ Portland facility has completed its audit for the transition to ISO 13485:2016 and re-certification to ISO 9001:2015.

“Our internal team did a great job in supporting the transition to latest revision of ISO 13485. While the preparation done last year for the transition to ISO 9001:2015 helped, the two standards are no longer as closely aligned so there was still a significant level of effort required to ensure compliance with the standard’s requirements,” said Bob Willenbring, Milwaukee Electronics’ Corporate Quality Director.

The Portland facility was audited early in October and recommended for certification. There were three minor findings which have been corrected and will be submitted to the facility’s Registrar shortly.

The transition to the new standard more closely aligns the facility’s processes with FDA requirements in the areas of complaint handling, process validation and risk management.

Please read our latest newsletter for Milwaukee Electronics, which includes:

  • Large PCBA capabilities expanded in Milwaukee
  • Message from our CEO: Our latest investments
  • Our IT strategy is enabling changes to our business model to support our Design Engineering and PCBA capabilities
  • Corporate Quality Director
  • Organizational Changes
  • Mexico PCBA facility expansion update

Milwaukee Electronics Newsletter Q3 2018

In this latest edition of the Milwaukee Electronics’ Newsletter, we cover a range of topics including:

  • How Milwaukee Electronics Eliminates Risks in a Highly Constrained Market
  • New Corporate Materials Director is Named
  • Engineering In Action – Dense High Speed Digital Circuitry
  • New Equipment and Certifications
  • Streamlining Digital Documentation Processes

 

Click Here To Read:  Milwaukee Electronics Newsletter Q2 2018 (1)